News Center-Shanghai Xuanfeng Optoelectronic Technology Co., Ltd.

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

language

News Center

Company News

Industry News

Home

2026-08-25

What materials can the company primarily process?

We specialize in high-precision planar polishing, processing materials that span both the visible and infrared spectral ranges: ① Visible‑light/laser optical materials: optical glasses (such as K9 and BK7), quartz glass (including JGS1, JGS2, and JGS3), Corning series (e.g., 7980, 7979), and ZF‑series heavy flint glasses, among others. ② Infrared optical materials: single‑crystal germanium (Ge) and single‑crystal silicon (Si). These two materials are characterized by high hardness—silicon has a Vickers hardness of approximately 1150, while germanium is around 780—and relatively brittle textures, making them key strengths of our core manufacturing processes.

2026-08-25

What level of precision can be achieved with surface polishing?

We specialize in high-precision flat‑surface machining. Our standard batch‑production specifications are as follows: ① Surface figure accuracy: PV (peak-to-valley) can reach λ/20 or better (λ = 632.8 nm), depending on the material and process. ② Surface finish: Can achieve 10/5 or higher, with no surface defects such as pitting or scratches. ③ Parallelism: Can be controlled to within seconds of arc or to a thickness difference of sub‑micron levels, according to customer‑specified drawing requirements.

2026-08-25

Why are the processing costs of infrared materials (such as germanium and silicon) higher than those of glass?

This is primarily determined by the material’s physical properties: ① High hardness and brittleness: The Knoop hardness of germanium and silicon is significantly higher than that of ordinary optical glass, resulting in longer polishing and grinding times and greater wear on grinding wheels and abrasives. ② Susceptibility to chipping and breakage: Due to their high hardness and brittleness, infrared materials are prone to stress‑induced chipping during machining, increasing the risk of scrap. ③ High unit cost: The per‑gram cost of infrared materials far exceeds that of conventional glass, and their processing requires specialized cooling fluids and contamination‑control measures.

Why do the surfaces of polished lenses sometimes exhibit “sand holes” or “pitted spots”?

“Scratches” typically arise when the damaged layer left by the preceding process—whether rough grinding or fine grinding—is not completely removed. Possible causes include: ① The abrasive grains used in the previous step were too coarse, resulting in an excessively deep damage layer. ② Insufficient polishing time or improper selection of the polishing‑powder particle size. We rigorously control the material removal at each stage of the process to ensure that fine grinding can fully eliminate the scratches from the prior step and that adequate polishing allowance remains.

2026/08

What processes are typically involved in optical cold machining?

For planar polishing components, the standard process includes: Milling (shaping) → Fine grinding (correcting R‑value and flatness) → Polishing (achieving surface finish and profile) → Cleaning (to prevent polishing powder from curing) → Inspection

2026/08

What is double-sided polishing? What are the challenges of single-sided polishing?

① Double-sided polishing: This process simultaneously machines both the top and bottom surfaces of the workpiece, effectively eliminating stress‑induced deformation that can occur with single‑sided polishing. It is particularly well suited for achieving high parallelism in thin wafers and window substrates. ② Single-sided polishing: Only one surface is polished. The main challenge is the tendency to cause edge chipping or surface‑profile distortion due to residual stresses. We address these issues through specialized fixture design and precise pressure control.

2026/08

How can surface form accuracy and surface quality be measured?

We have a comprehensive suite of inspection methods: ① Surface‑profile interferometer: used to measure flatness (PV and RMS values). ② Surface defect inspection: under standard illumination, compare against reference samples to detect scratches and pitting in accordance with U.S. military standard MIL or Chinese national standard GB. ③ Thickness/parallelism measurement: employ dial indicators or laser thickness gauges to monitor dimensional consistency.

2026/08

How can you keep your lenses clean after polishing?

If polishing powder hardens on the surface after polishing, it becomes very difficult to remove. In our process: ① Immediate cleaning: Immediately after polishing the workpiece, it is cleaned using an ultrasonic cleaning line. ② Contamination prevention and isolation: Tooling and fixtures are strictly segregated among rough grinding, fine grinding, and polishing areas to prevent cross-contamination from abrasives of different particle sizes, which could cause scratches.

2026/08

Featured Exhibit | [Youwei Optoelectronics] A wide range of infrared optical components are extensively used in semiconductors and microelectronics, security, industry, and many other fields.

Exhibition Dates: September 9–11, 2026 Exhibiting Company: Suzhou Youwei Optoelectronics Technology Co., Ltd. Booth Number: Infrared Technology and Applications Exhibition, Hall 8, Booth 8D20 Products on Display: Germanium polishing wafers, silicon polishing wafers, precision optical components, precision drilled optical components, and more.

2026/04

Downstream applications are flourishing across multiple sectors, driving a sustained surge in demand for precision optical cold‑processing services.

Since 2026, driven by robust demand across multiple downstream applications—including semiconductors, consumer electronics, AI vision, infrared thermal imaging, and automotive sensing—the precision optical cold‑processing industry has maintained a sustained upward trend.

2026/03

Many regions have rolled out a flurry of industrial policies, ushering in a new window of opportunity for the precision optics manufacturing sector.

Recently, Fujian, Zhenjiang, and other regions have successively unveiled high‑quality development plans for the optoelectronics and visual optics industries, designating precision optical manufacturing as a key area for cultivation and support. This has ushered in clear policy benefits for the ultra‑precision cold‑working segment at the upstream end of the industry chain.

2026/07

Shanghai Factory Address: No. 306, Shenxia Road, Malu Town, Jiading District, Shanghai

Suzhou Factory Address: Building No. 6, No. 26 Anfu Road, Dongbang Town, Changshu City, Jiangsu Province

Contact: Mr. Zhou

Phone: 021-59962896

Mobile: 13681782636

Email: zhouqh@shxfop.com.cn

Navigation

About Us

Products and Services

Technical Process

Service Support

News Center

Stay tuned for new product updates.