Why are the processing costs of infrared materials (such as germanium and silicon) higher than those of glass?-Shanghai Xuanfeng Optoelectronic Technology Co., Ltd.

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Why are the processing costs of infrared materials (such as germanium and silicon) higher than those of glass?

2026-08-25

This is primarily determined by the material’s physical properties: ① High hardness and brittleness: The Knoop hardness of germanium and silicon is significantly higher than that of ordinary optical glass, resulting in longer polishing and grinding times and greater wear on grinding wheels and abrasives. ② Susceptibility to chipping and breakage: Due to their high hardness and brittleness, infrared materials are prone to stress‑induced chipping during machining, increasing the risk of scrap. ③ High unit cost: The per‑gram cost of infrared materials far exceeds that of conventional glass, and their processing requires specialized cooling fluids and contamination‑control measures.

This is primarily determined by the material’s physical properties:
① High hardness and brittleness: The Knoop hardness of germanium and silicon is significantly higher than that of ordinary optical glass, implying longer polishing and grinding times and greater wear of grinding wheels and abrasives.
② Chipping and breakage: Infrared materials exhibit high hardness and brittleness, making them prone to stress‑induced chipping during machining, which increases the risk of scrap.
③ High material cost: Infrared materials have a per-gram cost far exceeding that of ordinary glass, and their processing requires specialized cooling fluids and anti-contamination measures.

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Featured Exhibit | [Youwei Optoelectronics] A wide range of infrared optical components are extensively used in semiconductors and microelectronics, security, industry, and many other fields.

Exhibition Dates: September 9–11, 2026 Exhibiting Company: Suzhou Youwei Optoelectronics Technology Co., Ltd. Booth Number: Infrared Technology and Applications Exhibition, Hall 8, Booth 8D20 Products on Display: Germanium polishing wafers, silicon polishing wafers, precision optical components, precision drilled optical components, and more.