What is double-sided polishing? What are the challenges of single-sided polishing?
① Double-sided polishing: This process simultaneously machines both the top and bottom surfaces of the workpiece, effectively eliminating stress‑induced deformation that can occur with single‑sided polishing. It is particularly well suited for achieving high parallelism in thin wafers and window substrates.
② Single-sided polishing: Only one surface is polished. The main challenge is the tendency to cause edge chipping or surface‑profile distortion due to residual stresses. We address these issues through specialized fixture design and precise pressure control.
① Double-sided polishing: This process simultaneously machines both the top and bottom surfaces of the workpiece, effectively eliminating stress‑induced deformation that can occur with single‑sided machining. It is particularly well suited for achieving high parallelism in thin wafers and window substrates.
② Single-sided polishing: Only one surface is polished. The main challenge is the tendency to develop edge collapse or surface‑shape distortion due to residual stresses. We address these stress‑induced deformations through a specialized fixture design and precise pressure control.
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Exhibition Dates: September 9–11, 2026
Exhibiting Company: Suzhou Youwei Optoelectronics Technology Co., Ltd.
Booth Number: Infrared Technology and Applications Exhibition, Hall 8, Booth 8D20
Products on Display: Germanium polishing wafers, silicon polishing wafers, precision optical components, precision drilled optical components, and more.