We specialize in high-precision planar polishing, with processing materials spanning both the visible and infrared spectral ranges:
① Visible-light/laser optical materials: optical glasses (such as K9 and BK7), quartz glass (including JGS1, JGS2, and JGS3), Corning series (such as 7980 and 7979), and ZF-series heavy flint glasses, among others.
② Infrared optical materials: single-crystal germanium (Ge) and single-crystal silicon (Si). These two materials exhibit high hardness—silicon has a Vickers hardness of approximately 1150, while germanium is around 780—and are relatively brittle, making them key strengths of our core manufacturing processes.

We specialize in high-precision flat‑surface machining. The standard production specifications for batch manufacturing are as follows:
① Surface figure accuracy: The PV value (peak-to-valley) can reach λ/20 or even better (λ = 632.8 nm), depending on the material and manufacturing process.
② Surface finish: Can reach 10/5 or even higher, with no surface defects such as pitting or scratches.
③ Parallelism: Can be controlled to within seconds (in angular deviation) or micrometer‑level thickness differences, as specified in the customer’s drawings.

This is primarily determined by the material’s physical properties:
① High hardness and brittleness: The Knoop hardness of germanium and silicon is significantly higher than that of ordinary optical glass, implying longer polishing and grinding times and greater wear of grinding wheels and abrasives.
② Chipping and breakage: Infrared materials exhibit high hardness and brittleness, making them prone to stress‑induced chipping during machining, which increases the risk of scrap.
③ High material cost: Infrared materials have a per-gram cost far exceeding that of ordinary glass, and their processing requires specialized cooling fluids and anti-contamination measures.

“Sand holes” typically arise when the damaged layer left by preceding processes—such as rough grinding or fine grinding—is not completely removed. Possible causes include:
① The grit size of the preceding process is too coarse, resulting in excessive damage to the surface layer.
② Insufficient polishing time or improper selection of polishing powder particle size.
We rigorously control the amount of material removed at each machining step to ensure that fine grinding completely eliminates any scratches from the previous operation, while leaving sufficient stock for polishing.

For planar polishing components, the standard procedure includes:
Milling and grinding (shaping) → Fine grinding (correcting R‑values and flatness) → Polishing (achieving surface finish and contour) → Cleaning (to prevent polishing compound from curing) → Inspection

① Double-sided polishing: This process simultaneously machines both the top and bottom surfaces of the workpiece, effectively eliminating stress‑induced deformation that can occur with single‑sided machining. It is particularly well suited for achieving high parallelism in thin wafers and window substrates.
② Single-sided polishing: Only one surface is polished. The main challenge is the tendency to develop edge collapse or surface‑shape distortion due to residual stresses. We address these stress‑induced deformations through a specialized fixture design and precise pressure control.